University of California, Riverside

Department of Electrical and Computer Engineering



NSF and SRC support research for enhancing thermal-related reliability and robustness of nanometer multi-core and 3D microprocessor chips.


NSF and SRC support research for enhancing thermal-related reliability and....
 
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NSF and SRC support research for enhancing thermal-related reliability and robustness of nanometer multi-core and 3D microprocessor chips.

January 31, 2013

Professor Sheldon Tan (PI)  received  a three –year grant (CCF- 1255899) from National Science Foundation and Semiconductor Research Corporation (SRC)  for exploring new techniques of  enhancing the reliability and robustness of  multi-core and emerging 3D microprocessors.  This award comes from the very competitive NSF/SRC Joint Initiative in Failure Resistance System (FRS) program.

Reliability has become a significant challenge for the current multi-core and emerging 3D microprocessor design.  Aggressive transistor scaling and increasing processor power density leads to excessive on-chip temperature and increases the risk that microprocessors will fail. Many long-term failure mechanisms are very sensitive to the temperature or temperature changes such as electro-migration, stress migration and thermal-cycling. The elevated temperature and temperature gradients due to continuous integration in multi-core and emerging 3D microprocessors have significant adverse effects on those reliability issues.  As reliability becomes a major design constraint for nanometer VLSI systems, it must be addressed at different layers.  This project will address this reliability related challenges facing semiconductor industry in the current and future sub-20nm technology nodes.

The outcome of this research will add significantly to the core knowledge of  reliability enhancement techniques for multi-core and 3D microprocessors. It will provide better design techniques to mitigate the emerging reliability-driven design methodology for current and future sub-20nm VLSI designs.

The project  is jointly supported by NSF and SRC for three years.  The UCR team will work closely with SRC member company,  Intel Corporation, and Mentor Graphics Corporation for the joint research efforts.

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